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SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

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FASTPCBA Co., Ltd.

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SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

Name: SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing
Brand: FASTPCBA
Price: 700 USD

China SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing wholesale

Brand Name : FASTPCBA

Model Number : FASTPCBA-004

Certification : ISO9001 / IATF16949 / ISO13485

Place of Origin : China

MOQ : 1

Price : 700-5000

Payment Terms : D/A, D/P, T/T, Western Union, MoneyGram, L/C

Supply Ability : 100000

Delivery Time : 5-8 work days

Packaging Details : Anti-static bag + white pearl cotton (used around the inside of the carton) + carton

Copper thickness : 0.25OZ~12OZ

Base material : FR-4

Material : FR4 CEM1 CEM3 Hight TG

Layer : 1~20 layers

Pcb standard : IPC-A-610 D/IPC-III Standard

Min. line spacing : 0.003"

Product name : Printed Circuit Board

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PCB Assembly SMT , BGA , DIP Double-Sided Pcb Assembly Factory

Product description:
Specializing in the production of high-precision and high- difficulty double-sided multilayer PCB circuit boards, double-sided multilayer PCB circuit board proofing batch production and processing manufacturers, fastpcba

SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing
Our product manufacturing capabilities:

PCB process capability
Item	Large processing capacity	Small processing capacity
Layers (maximum)	2--18	20-30
Plate type	FR-4, ceramic plate, aluminum base plate	PTFE,PPO ,PPE
	Teflon, halogen-free sheet, high Tg sheet
	Rogers, etc Teflon	E-65,ect
Plate mixed pressure	4 layers-6 layers	6 layers-8 layers
biggest size	610mm X 1100mm
Dimensional accuracy	±0.13mm	±0.10mm
Board thickness range	0.2mm--6.00mm	0.20mm--8.00mm
Board thickness tolerance (t≥0.8mm)	±8%	±5%
Board thickness tolerance (t <0.8mm)	±10%	±8%
Medium thickness	0.076mm--6.00mm	0.076mm--0.100mm
Minimum line width	0.10mm	0.075mm
Minimum distance	0.10mm	0.075mm
Outer copper thickness	8.75um--175um	8.75um--280um
Inner copper thickness	17.5um--175um	8.75um--175um
Drilling hole diameter (mechanical drill)	0.25mm--6.00mm	0.15mm--0.25mm
Hole diameter (mechanical drill)	0.20mm--6.00mm	0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)	0.05mm
Hole position tolerance (mechanical drill)	0.075mm	0.050mm
Laser drilling aperture	0.10mm	0.075mm
Plate thickness aperture ratio	10:01	12:01
Solder mask type	Sensitive green, yellow, black, purple, blue, ink
Minimum solder mask width	0.10mm	0.075mm
Minimum solder mask isolation ring	0.05mm	0.025mm
Plug hole diameter	0.25mm--0.60mm	0.60mm-0.80mm
Impedance tolerance	±10%	±5%
Surface treatment type	Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card	Chemical sinking tin, OSP

Our production equipment: the advanced level of the equipment determines the product quality and efficiency:

SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

Product 100 testing:

SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

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